Investigation on Rheological Characterization of Isotropic Conductive Adhesives
نویسندگان
چکیده
Abstract In the field of microelectronic packaging technology, isotropic conductive adhesives (ICAs) have been used widely as interconnection materials between chips and substrates. ICAs are composed silver powder particles adhesive matrix. The paper analysed rheological properties at different temperatures in order to better apply dispensing jet printing processes. viscosity, viscoelasticity, thixotropic behaviours were studied using various experimental methods such oscillatory stress shear, rotational rheology. conforms Cross Model. SAOS flow field, has G”>G’ LVR region, which shows viscous component is dominant represent viscoelastic fluid characteristics.
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ژورنال
عنوان ژورنال: Journal of physics
سال: 2023
ISSN: ['0022-3700', '1747-3721', '0368-3508', '1747-3713']
DOI: https://doi.org/10.1088/1742-6596/2578/1/012021